Area of probe manipulation: up to 2500x1900 mm
ISONIC MIA Bond Mapping System
Technical Data Sheet
Special Data
Monitoring bond probe location (X,Y):
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Resolution: ± 1 mm at maximum range |
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Area of probe manipulation: up to 2500x1900 mm |
Monitoring of testing integrity:
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Real time recording and imaging actual trace of bond probe over object under test with graphical resolution of 12.8 mm (0.5"); breaking recording and imaging if missing coupling between bond probe and object under test |
Imaging of defects:
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Real time recording and imaging defects on the scanning map upon getting corresponding signal from output of bond tester with graphical resolution of 12.8 mm (0.5") |
Saving/Printing Fully Objective Inspection Report Containing:
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Primary Inspection Data – Description of object under test, operator data, time of inspection, etc. |
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Main Inspection Data – Inspection map displaying actual trace of bond probe and images of defects if detected |
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Defects Data – List of detected defects, including their coordinates with resolution of 1 mm and comments made by an operator |
Intelligent Postprocessing of Recorded Inspection Data:
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Automatic detecting and counting of defects, measuring their coordinates with resolution of 1 mm |
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Printing fully objective inspection report and accompanying pages |
General Data
Source of Bond Characterization Signal:
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Output of Staveley MIA 2500 bond tester |
Searching unit:
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Staveley MIA 2500 probe |
Host Computer:
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Fieldworks 7000:Pentium-133MHz, RAM-32M, Hard Drive 2.1G, Floppy Drive 1.44M, active TFT sVGA LCD True Color 800x600 |
Operating System:
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Windows 95 or higher |